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Throughout the processing process, the laser processing special configuration ensures that the cutting edge is smooth and free of burrs, and the efficient dust collector ensures that the processing surface is free from pollution.
1. High precision: The combination of high-quality hardware and perfect software developed for specific applications ensures high precision and high productivity.
2. High cost and income: Use CuttingMaster to get the best quality clean cutting by using the cost of ordinary splitting process.
3. High reliability: During the entire processing process, the laser processing special configuration ensures that the cutting edge is smooth and free of burrs, and the efficient dust collector ensures that the processing surface is free of pollution.
4. Wide range of applications: it can process a variety of materials from rigid to flexible, whether it is an independent system or an online system-it can be easily dealt with with different models of fixtures or vacuum adsorption tables.
5. Fast processing speed: continuous optimization of technology and high-level equipment performance ensure processing speed.
6. High degree of automation: the automation level of production and processing can be selected according to customer needs.
7. Material cost saving: stress-free, non-contact material processing, extremely narrow insulation channel, and more efficient use of materials.
8. Perfect after-sales service: the strongest support from high-quality customers worldwide.
Why use laser sub-board? Compared with the traditional splitting process, laser splitting has many advantages:
1. Non-contact processing will not produce mechanical stress on the workpiece, and the material near the cutting channel will not be affected. The cutting edge can be close to the components, which improves the imposition density and saves materials. It is especially suitable for full-cut processing of circuit boards.
2. The laser can produce very narrow insulating channels with high precision, and can process various flexible and rigid materials. The digital software-controlled laser processing can cut arbitrary geometric figures.
3. Less loss of laser equipment, saving material cost and processing cycle. The LPKF laser system is designed for all-weather production design and is very suitable for sensitive applications, such as medical technology, automotive industry and consumer electronics.
4. The precision and process cleanliness produced by the LPKF CleanCut method are very high and will not produce powder in the milling process. Carbonization or other pollution, conclusion: The processed PCB is extremely reliable.
1. CleanCut technology:
The LPKF CuttingMaster 2000 series has a compact structure, a small footprint, and saves production space. CleanCut technology ensures that the cutting edge is technically clean and free of burrs.
2. High cost performance:
The LPKF CuttingMaster 2000 series are affordable and cost-effective equipment. The LPKF CuttingMaster surpasses the cost advantage of the previous conventional laser sub-board.
3. Compact system:
The LPKF sub-board series has the same cost as the mechanical method and better quality.
LPKF CuttingMaster |
2000 P |
2000 ci |
Maximum processing area (XYZ) |
350mm*350mm*11mm |
350mm*250mm*11mm |
positioning accuracy |
±25 |
/ |
Spot diameter |
<20 |
/ |
Equipment size (W*H*D) |
875mm*1510mm*1125mm |
/ |
weight |
450kg |
/ |
Optional |
Fixed Pin, product fixture, MES working mode, SMEMA interface |
/ |
Remarks: including status indicator height: 2070mm |
Laser power |
wavelength |
Pulse width |
2000 series |
CleanCut |
15W |
355nm(UV) |
nano second |
2115 |
/ |
27W |
355nm(UV) |
nano second |
2127 |
/ |
32W |
532nm(green) |
nano second |
2232 |
/ |
The highest accuracy: LPKF CuttingMaster 3000 series are equipped with linear motors to ensure high positioning accuracy and better performance.
Larger processing area: The processing range is wider than that of the 2000 series.
Flexible system: For processing different applications and materials, it is equipped with very fast nanosecond or picosecond lasers with different laser wavelengths.
CleanCut technology: CuttingMaster 3000 can also be used for drilling, and the stable granite countertop ensures reliable accuracy
LPKF CuttingMaster |
3000 P |
2000 ci |
Maximum processing area (XYZ) |
500mm*350mm*11mm |
460mm*305mm*11mm |
positioning accuracy |
±20 |
/ |
Spot diameter |
<20 |
/ |
Equipment size (W*H*D) |
1050mm*1500mm*2000mm |
/ |
weight |
1300kg |
/ |
Optional |
Fixed Pin, product fixture, MES working mode, SMEMA interface |
/ |
Remarks: including status indicator height: 2120mm |
Laser power |
wavelength |
Pulse width |
2000 series |
CleanCut |
27W |
355nm(UV) |
nano second |
3127 |
/ |
36W |
532nm(green) |
nano second |
3236 |
/ |
40W |
355nm(UV) |
pico second |
3440 |
/ |
65W |
532nm(green) |
pico second |
3565 |
/ |
1.LPKF software:
All CuttingMaster systems are equipped with powerful system software. Its design is simple and perfectly matched with hardware, and is compatible with all standard procedures used in PCB production. It accurately processes circuit board data and guides users to complete each step of the processing process.
2. LPKF system improvement:
In order to ensure that the laser system brings the most excellent processing performance to customers, LPKF engineers do their best to make the equipment perfect and easy to operate. LPKF engineers have developed the best system software to meet all the functions required for production operations. Training, maintenance and other service options are required. You can contact us at any time, LPKF hardware, software, after-sales service award processing sub-board demand to ensure products.
Advantages of CircuitPro software:
1. Personalized MES working method
2. Diversified Mark point recognition
3. (Bad) board recognition 4.
HERMES standard and SMEMA interface
5. Traceability (laser compliance)
6. Data can be read and written Enter
1. Commitment: Warranty period: 1 year, lifetime maintenance. Response time: After receiving the user's notice, professional and technical personnel will not exceed 24 hours (local) and 48 hours (off-site) on-site service to ensure 24-hour uninterrupted after-sales technical service support; repair time: 48 hours.
2. Free warranty: Free warranty during the warranty period, and after the warranty period, spare parts and maintenance services are guaranteed at a reasonable price.
3. Free training: On the day of training, the purchaser’s technical personnel will be trained on the equipment operation for free to ensure that the user’s personnel can be proficient in conventional use methods such as various equipment and software, as well as the judgment and resolution of minor faults.